|
|
|
| Founded in 1982 Martin has been developing innovative rework and dispensing equipment for more than 25 years. In 2005 the Auto Vision Expert 09.5 MARTIN set new standards for rework and after selling almost 1000 systems of the previous versions the NEW Expert09.6H has developed into the world wide standard for rework and repair of mobile telephones. |
|
 |
Expert-09.6
The Expert-09.6 rework system is capable of reworking all SMT devices (BGA, CSP & QFP) including the latest miniature components such as MicroSMD’s, QFN’s and LPP’s.
Lead-free rework demands a more precise reflow profile to ensure good solder wetting whilst guarding against component damage. With Martin’s Auto-profiling feature users of any experience level can set up new profiles with precise parameters.
The Auto Vision Placement (AVP) system used by the Expert-09.6 needs only a few mouse clicks to automatically place all SMD devices from 55mm² down to 1mm².
With Large IR area heating and gentle top-heat technology this system needs very little training and is extremely competitively priced. If you’re currently looking at a new rework system don’t make a decision until you’ve seen the Expert09.6.
The Expert-09.6H version is recommended by leading mobile phone manufacturers and service partners for reworking of BGA & CSP devices on mobile phone boards – it has the fastest rework cycle time allowing more repairs per hour than any other system. |
|
|
Side Camera
The side camera enables the operator to confirm placement accuracy, monitor the reflow process (witnessing the solder becoming liquidous) and so mark the true melting point temperature, a valuable tool which aids quality control and speeds up profiling of new devices. |
|
|
Reball-03.1
The Reball 03.1 offers reballing for virtually any BGA pattern or size.
BGA’s are simply set into the universal holder using the supplied frames; the universal masks in turn are masked to the relevant array with the use of kapton tape.
A range of BGA frames and Masks are available as standard and for high volume and special applications or for CSP’s and QFN’s we offer both standard and custom toolkits to suit all devices.
The Reball 03.1 uses Rapid IR technology which prevents damage to sensitive components and yet considerably speeds up the re-ball process by precisely controlling the ramp and reflow temperatures.
A simple “teach” and “programme” function allows for either a single device to be re-balled or for a program to be stored for fully repeatable profiles.
A comprehensive range of solder balls, fluxes and tools are available to provide the highest quality solution to your re-ball needs.
|
PDF Download |
|
Expert 04.6 Semi-Automated Rework
QFP/SO BGA CSP/QFN |
A cost effective Rework system for all SMD components.
The Expert 0.46 offers Rework for common SMT components, the simplicity of the system achieves maximum performance for reliable solder joints at an extraordinary low price.
Utilising technology from the larger, Expert 09 automatic equipment. Overheating is avoided, wetting is improved and process times are reduced.
PDF Download
|
| |
|
Star Tools are used to quickly determine the component position directly in relation to the pads. This location is mechanically stored and then used to simply place the component. That's it!
The placement arm together with the Star tools offers a simple manual placement of BGA’s and CSP’s as well as standard QFP and SOIC devices. |
|
|
Hot Jet 05
|
The Hot Jet 05 is a universal manual rework system allowing precise hot air regulation and with an optional gentle IR under-heater offers a very flexible solution for all manual soldering operations on surface mount printed circuit boards.
PDF Download |
| |
|
|
Chip Rework
- Gentle de-soldering with soldering nozzle and vacuum tool
- Application of flux crème, as required
- Placement of component with placement tool and soldering with solder nozzle
- IR under-heater provides safe, uniform heating during soldering process
QFP Rework
- Apply flux crème
- Safe de-soldering with soldering/vacuum tool prevents pad damage.
- Application of flux crème
- Placement with vacuum pen and SMD hook
- Solder with a QFP tool or a 4mm nozzle on hot-air pen, with a soldering iron or with a solder mini wave
- IR under-heater provides safe, uniform heating during soldering process
CSP/BGA Rework
- Gentle de-soldering with soldering tool, arm and suitable soldering program
- Removal of solder residue with soldering nozzle (4mm) and solder sucker/desolder pen
- Application of flux crème
- Placement with vacuum pen and SMD hook
- Solder with soldering tool, arm and suitable soldering program
- IR under-heater provides safe, uniform heating during soldering process
|
|
Hot Beam 03 PCB Under-Heater
PDF Download |
Lead free manual soldering can be challenging, raising the temperature by 30°C puts more demand on the soldering iron and the operator. This increases risk for components and significantly reduces soldering tip life. However by using a HotBeam03 under-heater the soldering tip temperature can actually be lowered by approximately 50°C.
The Rapid IR heating technology with user program storage allows for an accelerated solder process whilst not exceeding a permitted ramp rate of 3.5° C/sec. The use of sensors is only required during programming, not during actual soldering. |
|
Rework Dispenser 05.6
The MARTIN Rework Dispenser 05.6 allows processing of all types of components such as QFP’s, BGA’s, CSP’s and QFN’s.
The Easy Dispense software provides a simple solution to creating accurate repeatable dispense patterns for all common components. Any dispensing programs not contained in the comprehensive program library can easily be established using CamDesigner or the editor. The Rework Dispenser 05.6 supports conformance to IPC standard A-610C and provides the assurance needed for reworking printed circuit boards with high and very high reliability requirements. |
|
