MARTIN BGA & CSP Rework & Dispensing



  


Martin’s NEW Expert-09.5 lead-free ready rework system is capable of reworking all SMT devices (BGA, CSP & QFP) as well as the latest miniature components such as MicroSMD’s & LPP’s. Lead-free rework demands a more precise reflow profile to ensure good solder wetting whilst guarding against component damage. With Martin’s Auto-profiling feature users of any experience level can set up new profiles with precise parameters.

The Auto Vision Placement (AVP) system used by the Expert-09.5 needs only a few mouse clicks to automatically place all SMD devices from 55mm2 down to 1mm2. With the NEW EasySolder05 software, Multi-zone (7 stage heating)

MicroSMD rework Low cost rework - The Expert-04 Series
CSP rework on mobile phone boards HotBeam03 lead-free under-heater
   

large IR area heating and gentle top-heat technology this system needs very little training and is extremely competitively priced. If you’re currently looking at a new rework system then a demonstration of this unit is essential as the Expert-09.5 is unlike any other rework machine available.

The Expert-09.5H is also recommended by several leading mobile phone manufacturers and service partners for reworking of BGA & CSP devices on mobile phone boards – it has a fast cycle time allowing more repairs per hour than other systems.
   
Expert09.5 lead-free BGA & CSP Rework System
  

The Expert-07.5, Expert-04.5 & Hot-Jet-05 range of low cost rework systems are available using the same heating technology but with alternative placement options. Whatever your rework requirements we can offer a solution at a price you can afford.

We can also offer from Martin: -

  • IR Under-heaters for improved lead-free manual soldering applications
  • BGA & CSP Reballing systems, including solder balls
  • Manual and Automatic paste dispensing systems for rework and prototype applications
 
 
Tochin Website Design | Ecommerce Website Design | Search Engine Optimisation Marketing