BGA reballing

Shenmao Technology Inc. have over 30 years experience in the solder material industry. As the leading solder material manufacturer in Taiwan they provide quality solder products for today’s demanding production needs.
 
                                  
 

Solder Paste

PF606-P25D FORMOSA No-Clean Lead-Free Solder Paste.

Features:

  • Excellent Wettability
  • High Print Speed: Up to 120mm/Sec
  • Low Voiding
  • Stencil life > 8hrs
  • Grain sizes 20-45 or 20-38

PDF Download - Product Data Sheet
PDF Download - Material Safety Sheet
bga reballing
   

PF606-R Lead-Free Solder Wire

Shenmao’s PF606-R lead-free solder wire incorporates the SAC Sn96.5Ag3.5Cu0.5 alloy but with a ROL1 flux for a more user friendly fast wetting and high quality solder joint.

Available in the following gauges:
0.3mm – 0.6mm, 0.8mm & 1.2mm

PDF Download - Product Data Sheet
PDF Download - Material Safety Sheet

   

BGA & CSP Solder Spheres

Shenmao offer a range of Sn/Pb and lead-free BGA & CSP Spheres for packaging and re-balling applications. These spheres are manufactured from the purest alloys in a precise way to offer the highest possible quality.

PDF Download - Product Data Sheet
PDF Download - Material Safety Sheet

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