Range of advanced rework machines for any SMT rework application

Semi-automated rework with large area hybrid underheaters for uniform heating of PCBs and vision placement for high accuracy positioning

Small footprint rework machines for mobile phone and smart phone repairs
Mid-range systems for laptop, PC, games consoles, TV's and monitor repairs
Large systems for big boards such as server board rework

Manual rework

Entry level SMT rework stations for small to medium sized boards not requiring vision placement

A comprehensive range of HD, high resolution, high magnification camera systems and digital microscopes

Digital BGA inspection systems
Full HD inspection camera systems
Digital high magnification microscopes
3-Axis optical XYZ measuring systems

BGA, CSP reballing solutions and QFN pre-bumping systems

Reballing BGAs can save significant costs and provide a simple solution for component obselecence

QFN pre-bumping offers a high quality repeatable solution for reworking these often awkward components

Mini oven systems for reflowing BGAs, CSPs, QFNs and other devices

BGA reball toolkits

QFN pre-bump set

By safely and uniformly heating the board we can significantly improve the quality of the solder joint as well as reduce the contact time with the soldering iron

We can offer a family of underboard heaters for demanding manual soldering applications in a range of sizes

The smaller systems use IR heating, whilst the larger underheaters use a hybrid, IR-air heat source for improved heating control

Automated paste and fluid dispensing systems for prototyping, small batch builds and rework applications

Volumetric dispensing technology ensures precise dispensing with temperature and pressure compensation

Manual dispenser for hand dispensing applications and for integration in to existing automated systems